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English 
Epoxy active diluent is a special type of diluent, mainly used in epoxy resin systems, with the following key characteristics and application fields:
Key characteristics
compatibility: Epoxy active diluent has good compatibility with epoxy resin, and can directly participate in the curing reaction of epoxy resin to form a crosslinking network structure.
Reduce viscosity: This type of diluent can effectively reduce the viscosity of epoxy resin and improve its process performance.
Enhanced performance: By participating in the curing reaction, epoxy active diluent not only reduces viscosity, but also enhances the flexibility of the cured substance and improves its mechanical and electrical insulation properties.
Application fields
Electronic and electrical packaging materials: such as structural bonding materials, semiconductor packaging materials, etc.
Fiber reinforced materials: used to enhance the properties and durability of materials.
Laminates and integrated circuits: In these fields, epoxy active diluents are used to improve the structural and electrical properties of materials.
Epoxy potting and casting: used to improve the mechanical and electrical insulation properties of these materials.
Anti-slip abrasion layer glue: In applications requiring high toughness, such as surfboards and floor anti-slip applications, epoxy active diluents can significantly improve the impact strength and cold impact resistance of the material.
Epoxy active diluent is a special type of diluent, mainly used in epoxy resin systems, with the following key characteristics and application fields:
Key characteristics
compatibility: Epoxy active diluent has good compatibility with epoxy resin, and can directly participate in the curing reaction of epoxy resin to form a crosslinking network structure.
Reduce viscosity: This type of diluent can effectively reduce the viscosity of epoxy resin and improve its process performance.
Enhanced performance: By participating in the curing reaction, epoxy active diluent not only reduces viscosity, but also enhances the flexibility of the cured substance and improves its mechanical and electrical insulation properties.
Application fields
Electronic and electrical packaging materials: such as structural bonding materials, semiconductor packaging materials, etc.
Fiber reinforced materials: used to enhance the properties and durability of materials.
Laminates and integrated circuits: In these fields, epoxy active diluents are used to improve the structural and electrical properties of materials.
Epoxy potting and casting: used to improve the mechanical and electrical insulation properties of these materials.
Anti-slip abrasion layer glue: In applications requiring high toughness, such as surfboards and floor anti-slip applications, epoxy active diluents can significantly improve the impact strength and cold impact resistance of the material.
